02-0511-11
$6.700 USD
CONN SOCKET SIP 2POS TIN
Available on Backorder: Manufacturer lead time 10-12 weeks
Description
GENERAL SPECIFICATIONS
- BODY: black UL 94V-0 glass-filled 4/6 Nylon
- PIN: Grade A Phosphor Bronze per QQ-B-750
- OPTIONAL SPACER: FR-4 0.032 [0.81] thick
- PIN PLATING: “0” 50-130µ min. matte Sn per ASTM B545-97(2004)e1 over 50µ Ni per SAE AMS-QQ-N-290B; “0TL”50-130µ 90/10 Sn/Pb per MIL-T-10727 Type 1 over 50µ Ni per SAE AMS-QQ-N-290B; “1” 10µ [0.25µ] min. Au per MIL-G-45204 over 50µ Ni per SAE AMS-QQ-N-290B
- CURRENT RATING: 1 amp
- OPERATING TEMPERATURE: -67°F to 221°F [-55°C to 105°C] Sn and Sn/Pb; -67°F to 257°F [-55°C to 125°C] Au
- INSERTION FORCE: 110g/pin average
- WITHDRAWAL FORCE: 75g/pin average
- ACCEPTS: flat leads up to 0.014 x 0.020 wide [0.36-0.51]; Round Leads up to 0.020 [0.51] dia.
- SOCKET ACCEPTS: lead lengths from seating plane 0.080-0.160 [2.03 4.06]
FEATURES
- For mounting liquid crystal displays and other high pin count or odd centered components
- Available in several sizes with bifurcated contacts in solder pin tails or wire wrap pins
- For Wire Wrap Pins, consult Data Sheet 12009
- Optional spacer available for mounting on 0.300 [7.62], 0.600 [15.24], 0.900 [22.86], 1.100 [27.94], and 1.300 [33.02] centers. Consult factory for other sizes
Download: Datasheet
Additional information
| Country Of Origin | US |
|---|
Brand
Aries Electronics
Corporate History
Aries Electronics, incorporated in 1972, began when the late William “Bill” Sinclair purchased the back panel line from Thomas & Betts Corporation. The line included IC sockets, headers, and printed circuit cards. Under Bill’s vision, Aries expanded the line to encompass a wide variety of packaging products, including sockets, headers and covers, programmable devices and a variety of jumper and cable assemblies. Aries has become established in the industry as a major source for unique connector products that solve a wide variety of packaging problems. Aries is the recognized industry leader in ZIF (Zero-Insertion-Force) Test Sockets for DIP, PGA, PLCC, and SOIC devices, and continues to be a leading source for a wide variety of specialty electronic connectors. In recent years, the company has made major inroads in the market for high-temperature sockets and flexible cable products. The addition of the Correct-A-Chip® product line established the company as a major source for “intelligent connectors” (incorporating other components, both passive and active), adapters (connectors that allow the use of one termination style on a board designed for a different termination style). Most recently, the company has developed and patented several concepts for BGA (ball grid array) and LGA (land grid array) sockets, and has acquired a high-frequency test and burn-in socket line, furthering growth in the test socket market.ARIES SUCCESS RESULTS FROM MASTERING SEVERAL MANUFACTURING PROCESSES…
- Custom High-Frequency (RF) Socket Design (-1dB Bandwidth at >60GHz)
- Patented Limited-Depth Pin Assembly (Correct-A-Chip Adaptors)
- Surface-mounting of Electronic Components onto adaptors
- Molding Engineered Plastics with Extremely Tight Tolerances (for devices on <0.2mm pitch)
- Bending Pins (Vertisocket™Line) LED/LCD applications
- Installation of Pins into Plastic
- Crimping Connectors on Flat Cable
- Flat Cable Wire Stripping and Separation
