66-PLS11049-12
$68.200 USDCONN SOCKET PGA ZIF GOLD
Showing 7327–7335 of 7455 results
Aries Electronics
Corporate History
Aries Electronics, incorporated in 1972, began when the late William “Bill” Sinclair purchased the back panel line from Thomas & Betts Corporation. The line included IC sockets, headers, and printed circuit cards. Under Bill’s vision, Aries expanded the line to encompass a wide variety of packaging products, including sockets, headers and covers, programmable devices and a variety of jumper and cable assemblies.
Aries has become established in the industry as a major source for unique connector products that solve a wide variety of packaging problems.
Aries is the recognized industry leader in ZIF (Zero-Insertion-Force) Test Sockets for DIP, PGA, PLCC, and SOIC devices, and continues to be a leading source for a wide variety of specialty electronic connectors.
In recent years, the company has made major inroads in the market for high-temperature sockets and flexible cable products. The addition of the Correct-A-Chip® product line established the company as a major source for “intelligent connectors” (incorporating other components, both passive and active), adapters (connectors that allow the use of one termination style on a board designed for a different termination style).
Most recently, the company has developed and patented several concepts for BGA (ball grid array) and LGA (land grid array) sockets, and has acquired a high-frequency test and burn-in socket line, furthering growth in the test socket market.
ARIES SUCCESS RESULTS FROM MASTERING SEVERAL MANUFACTURING PROCESSES…
- Custom High-Frequency (RF) Socket Design (-1dB Bandwidth at >60GHz)
- Patented Limited-Depth Pin Assembly (Correct-A-Chip Adaptors)
- Surface-mounting of Electronic Components onto adaptors
- Molding Engineered Plastics with Extremely Tight Tolerances (for devices on <0.2mm pitch)
- Bending Pins (Vertisocket™Line) LED/LCD applications
- Installation of Pins into Plastic
- Crimping Connectors on Flat Cable
- Flat Cable Wire Stripping and Separation
Our corporate objective of continued growth within the electronic packaging area, further establishes our position as a major international connector manufacturer. Our target growth markets are additional ZIF Test Socket applications and further expansion of our Correct-A-Chip® capabilities, with particular emphasis in the area of pick-and-place.
Our marketing has been through manufacturers’ representatives and distributors throughout the United States and Canada; through European distributors reporting to our sales office in Holland, and through our authorized agents in the rest of the world.
[ninja_form id=4]
CML
Ohmite