PIN PLATING: “0” 50-130µ min. matte Sn per ASTM B545-97(2004)e1 over 50µ Ni per SAE AMS-QQ-N-290B; “0TL”50-130µ 90/10 Sn/Pb per MIL-T-10727 Type 1 over 50µ Ni per SAE AMS-QQ-N-290B; “1” 10µ [0.25µ] min. Au per MIL-G-45204 over 50µ Ni per SAE AMS-QQ-N-290B
CURRENT RATING: 1 amp
OPERATING TEMPERATURE: -67°F to 221°F [-55°C to 105°C] Sn and Sn/Pb; -67°F to 257°F [-55°C to 125°C] Au
INSERTION FORCE: 110g/pin average
WITHDRAWAL FORCE: 75g/pin average
ACCEPTS: flat leads up to 0.014 x 0.020 wide [0.36-0.51]; Round Leads up to 0.020 [0.51] dia.
SOCKET ACCEPTS: lead lengths from seating plane 0.080-0.160 [2.03 4.06]
For mounting liquid crystal displays and other high pin count or odd centered components
Available in several sizes with bifurcated contacts in solder pin tails or wire wrap pins
Aries Electronics, incorporated in 1972, began when the late William “Bill” Sinclair purchased the back panel line from Thomas & Betts Corporation. The line included IC sockets, headers, and printed circuit cards. Under Bill’s vision, Aries expanded the line to encompass a wide variety of packaging products, including sockets, headers and covers, programmable devices and a variety of jumper and cable assemblies.
Aries has become established in the industry as a major source for unique connector products that solve a wide variety of packaging problems.
Aries is the recognized industry leader in ZIF (Zero-Insertion-Force) Test Sockets for DIP, PGA, PLCC, and SOIC devices, and continues to be a leading source for a wide variety of specialty electronic connectors.
In recent years, the company has made major inroads in the market for high-temperature sockets and flexible cable products. The addition of the Correct-A-Chip® product line established the company as a major source for “intelligent connectors” (incorporating other components, both passive and active), adapters (connectors that allow the use of one termination style on a board designed for a different termination style).
Most recently, the company has developed and patented several concepts for BGA (ball grid array) and LGA (land grid array) sockets, and has acquired a high-frequency test and burn-in socket line, furthering growth in the test socket market.
ARIES SUCCESS RESULTS FROM MASTERING SEVERAL MANUFACTURING PROCESSES…
Custom High-Frequency (RF) Socket Design (-1dB Bandwidth at >60GHz)
Our corporate objective of continued growth within the electronic packaging area, further establishes our position as a major international connector manufacturer. Our target growth markets are additional ZIF Test Socket applications and further expansion of our Correct-A-Chip® capabilities, with particular emphasis in the area of pick-and-place.
Our marketing has been through manufacturers’ representatives and distributors throughout the United States and Canada; through European distributors reporting to our sales office in Holland, and through our authorized agents in the rest of the world.