02-3625-71
$1.750 USD
CONN HDR DIP POST 2POS GOLD
Available on Backorder: Manufacturer lead time 10-12 weeks
Description
GENERAL SPECIFICATIONS
- BODY MATERIAL: black UL 94V-0 glass-filled 4/6 Nylon
- FORK AND POST CONTACTS: Brass 360 1/2-hard per UNS C36000 ASTM B16/B16M-05
- SOLDER CUP CONTACTS: Phosphor Bronze per 544 UNS C54400 ASTM B139-01
- CONTACT PLATING: either 10µ [0.25µ] min. Au per MIL-G-45204 or 200µ [5.08µ] min. 93/7 Sn/Pb per ASTM B545 or 200µ [5.08µ] min. Sn per ASTM B545 Type 1 over 100µ [2.54µ] min. Ni per SAE AMS-QQ-N-290B
- CONTACT CURRENT RATING: 2 amps (3 amps for Pin Style 5)
- OPERATING TEMPERATURE: -67°F to 221°F [-55°C to 105°C] Sn & Sn/Pb plating; -67°F to 257°F [-55°C to 125°C] Au plating
- FORK CONTACT ACCEPTS: Leads up to 0.035 [0.89] dia.
FEATURES
- Aries offers a full line of DIP Headers, available with either screw machine or coined contacts in a variety of styles
- For Coined Contacts, consult Data Sheet 12032
Download: Datasheet
Additional information
| Country Of Origin | US |
|---|
Brand
Aries Electronics
Corporate History
Aries Electronics, incorporated in 1972, began when the late William “Bill” Sinclair purchased the back panel line from Thomas & Betts Corporation. The line included IC sockets, headers, and printed circuit cards. Under Bill’s vision, Aries expanded the line to encompass a wide variety of packaging products, including sockets, headers and covers, programmable devices and a variety of jumper and cable assemblies. Aries has become established in the industry as a major source for unique connector products that solve a wide variety of packaging problems. Aries is the recognized industry leader in ZIF (Zero-Insertion-Force) Test Sockets for DIP, PGA, PLCC, and SOIC devices, and continues to be a leading source for a wide variety of specialty electronic connectors. In recent years, the company has made major inroads in the market for high-temperature sockets and flexible cable products. The addition of the Correct-A-Chip® product line established the company as a major source for “intelligent connectors” (incorporating other components, both passive and active), adapters (connectors that allow the use of one termination style on a board designed for a different termination style). Most recently, the company has developed and patented several concepts for BGA (ball grid array) and LGA (land grid array) sockets, and has acquired a high-frequency test and burn-in socket line, furthering growth in the test socket market.ARIES SUCCESS RESULTS FROM MASTERING SEVERAL MANUFACTURING PROCESSES…
- Custom High-Frequency (RF) Socket Design (-1dB Bandwidth at >60GHz)
- Patented Limited-Depth Pin Assembly (Correct-A-Chip Adaptors)
- Surface-mounting of Electronic Components onto adaptors
- Molding Engineered Plastics with Extremely Tight Tolerances (for devices on <0.2mm pitch)
- Bending Pins (Vertisocket™Line) LED/LCD applications
- Installation of Pins into Plastic
- Crimping Connectors on Flat Cable
- Flat Cable Wire Stripping and Separation


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