03-0513-11H

Corporate History

Aries Electronics, incorporated in 1972, began when the late William “Bill” Sinclair purchased the back panel line from Thomas & Betts Corporation. The line included IC sockets, headers, and printed circuit cards. Under Bill’s vision, Aries expanded the line to encompass a wide variety of packaging products, including sockets, headers and covers, programmable devices and a variety of jumper and cable assemblies. Aries has become established in the industry as a major source for unique connector products that solve a wide variety of packaging problems. Aries is the recognized industry leader in ZIF (Zero-Insertion-Force) Test Sockets for DIP, PGA, PLCC, and SOIC devices, and continues to be a leading source for a wide variety of specialty electronic connectors. In recent years, the company has made major inroads in the market for high-temperature sockets and flexible cable products. The addition of the Correct-A-Chip® product line established the company as a major source for “intelligent connectors” (incorporating other components, both passive and active), adapters (connectors that allow the use of one termination style on a board designed for a different termination style). Most recently, the company has developed and patented several concepts for BGA (ball grid array) and LGA (land grid array) sockets, and has acquired a high-frequency test and burn-in socket line, furthering growth in the test socket market.

ARIES SUCCESS RESULTS FROM MASTERING SEVERAL MANUFACTURING PROCESSES…

• Custom High-Frequency (RF) Socket Design (-1dB Bandwidth at >60GHz)
• Patented Limited-Depth Pin Assembly (Correct-A-Chip Adaptors)
• Surface-mounting of Electronic Components onto adaptors
• Molding Engineered Plastics with Extremely Tight Tolerances (for devices on <0.2mm pitch)
• Bending Pins (Vertisocket™Line) LED/LCD applications
• Installation of Pins into Plastic
• Crimping Connectors on Flat Cable
• Flat Cable Wire Stripping and Separation

Our corporate objective of continued growth within the electronic packaging area, further establishes our position as a major international connector manufacturer. Our target growth markets are additional ZIF Test Socket applications and further expansion of our Correct-A-Chip® capabilities, with particular emphasis in the area of pick-and-place. Our marketing has been through manufacturers’ representatives and distributors throughout the United States and Canada; through European distributors reporting to our sales office in Holland, and through our authorized agents in the rest of the world.