Description
GENERAL SPECIFICATIONS
- HEADER BODY AND COVER: black UL 94V-0 4/6 Nylon
- HEADER PINS: Brass 1/2-hard
- STANDARD PIN PLATING: 10μ [0.25μ] min. Au per MIL-G-45204 over 50μ [1.27μ] min. Ni per QQ-N-290
- OPTIONAL PLATING: 200μ [5.08μ] min. matte Sn per ASTM B545-97(2004)e1 over 50μ [1.27mm] min. Ni per QQ-N-290; –OR– 200μ [5.08μ] 90/10 Sn/Pb per MIL-T-10727 Type I over 50μ [1.27μ] min. Ni per QQ-N-290
- CABLE INSULATION: UL style 2697 Polyvinyl Chloride (PVC)
- CABLE LAMINATE: clear PVC, self-extinguishing*
- 0.050 [1.27] PITCH CONDUCTORS: 28-AWG, 7/36-strand, tinned Cu per ASTM B 33
- 0.039 [0.99] PITCH CONDUCTORS: 26-AWG, 7/34-strand)
- CABLE CURRENT RATING: 1 amp at 10°C [50°F] above ambient
- CABLE VOLTAGE RATING: 300V
- CABLE TEMPERATURE RATING: 176°F [80°C]
- CABLE CAPACITANCE: 13.0pF/ft. [42.7pF/meter] nominal at 1MHz*
- CROSSTALK: 10-ft sample, 5ns rise time with 2 lines driven; near end 4.7%; far end 4.3% nominal*
- PROPAGATION DELAY: 1.5ns/ft. [4.9ns/meter] nominal*
- INSULATION RESISTANCE: 1010Ω (10 ft. [3 meters] min.)
FEATURES
- Wide Array of DIP Jumper Configurations and Wiring Possibilities
- Reliable, Electronically-tested Solder Connections
- Protective Covers Ultrasonically-welded with Strain Relief
- Easy Identification and Tracing with 10-color Cable
Download: Datasheet
Additional information
Country Of Origin | US |
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Brand
Aries Electronics
Corporate History
Aries Electronics, incorporated in 1972, began when the late William “Bill” Sinclair purchased the back panel line from Thomas & Betts Corporation. The line included IC sockets, headers, and printed circuit cards. Under Bill’s vision, Aries expanded the line to encompass a wide variety of packaging products, including sockets, headers and covers, programmable devices and a variety of jumper and cable assemblies. Aries has become established in the industry as a major source for unique connector products that solve a wide variety of packaging problems. Aries is the recognized industry leader in ZIF (Zero-Insertion-Force) Test Sockets for DIP, PGA, PLCC, and SOIC devices, and continues to be a leading source for a wide variety of specialty electronic connectors. In recent years, the company has made major inroads in the market for high-temperature sockets and flexible cable products. The addition of the Correct-A-Chip® product line established the company as a major source for “intelligent connectors” (incorporating other components, both passive and active), adapters (connectors that allow the use of one termination style on a board designed for a different termination style). Most recently, the company has developed and patented several concepts for BGA (ball grid array) and LGA (land grid array) sockets, and has acquired a high-frequency test and burn-in socket line, furthering growth in the test socket market.ARIES SUCCESS RESULTS FROM MASTERING SEVERAL MANUFACTURING PROCESSES…
- Custom High-Frequency (RF) Socket Design (-1dB Bandwidth at >60GHz)
- Patented Limited-Depth Pin Assembly (Correct-A-Chip Adaptors)
- Surface-mounting of Electronic Components onto adaptors
- Molding Engineered Plastics with Extremely Tight Tolerances (for devices on <0.2mm pitch)
- Bending Pins (Vertisocket™Line) LED/LCD applications
- Installation of Pins into Plastic
- Crimping Connectors on Flat Cable
- Flat Cable Wire Stripping and Separation
