18-3511-10
$2.790 USD
CONN IC DIP SOCKET 18POS TIN
Available on Backorder: Manufacturer lead time 10-12 weeks
Description
GENERAL SPECIFICATIONS
- STANDARD BODY: black UL 94V-0 glass-filled 4/6 Nylon
- BIFURCATED CONTACTS: Grade A spring-tempered Phosphor Bronze per QQ-B-750
- PIN PLATING: “0” 50-130µ min. matte Sn per ASTM B545-97(2004)e1
over 50µ Ni per SAE AMS-QQ-N-290B; “0TL” 50-130µ 90/10
Sn/Pb per MIL-T-10727 Type 1 over 50µ Ni per SAE AMS-QQ-N-290B; “1” 10µ [0.25µ]
min. Au per MIL-G-45204 over 50µ Ni per SAE AMS-QQ-N-290B - CONTACT CURRENT RATING: 1 amp
- OPERATING TEMPERATURE: -67°F to 221°F [-55°C to105°C] Sn;
-67°F to 257°F [-55°C 125°C] Au - INSERTION FORCE: 110g/pin average
- WITHDRAWAL FORCE: 75g/pin average
- ACCEPTS: flat leads up to 0.014 thick x 0.020 wide [0.36 x 0.51], Round Leads
up to 0.020 [0.51] dia. - SOCKET ACCEPTS: lead lengths from seating plane from 0.075-0.160 [1.91-4.06]
FEATURES
- Standard DIP sockets are available with Solder Pin Tails or Wire Wrap Pins, both with bifurcated contacts
- Aries offers these standard DIP sockets in more sizes than any other manufacturer
Download: Datasheet
Additional information
| Country Of Origin | US |
|---|
Brand
Aries Electronics
Corporate History
Aries Electronics, incorporated in 1972, began when the late William “Bill” Sinclair purchased the back panel line from Thomas & Betts Corporation. The line included IC sockets, headers, and printed circuit cards. Under Bill’s vision, Aries expanded the line to encompass a wide variety of packaging products, including sockets, headers and covers, programmable devices and a variety of jumper and cable assemblies. Aries has become established in the industry as a major source for unique connector products that solve a wide variety of packaging problems. Aries is the recognized industry leader in ZIF (Zero-Insertion-Force) Test Sockets for DIP, PGA, PLCC, and SOIC devices, and continues to be a leading source for a wide variety of specialty electronic connectors. In recent years, the company has made major inroads in the market for high-temperature sockets and flexible cable products. The addition of the Correct-A-Chip® product line established the company as a major source for “intelligent connectors” (incorporating other components, both passive and active), adapters (connectors that allow the use of one termination style on a board designed for a different termination style). Most recently, the company has developed and patented several concepts for BGA (ball grid array) and LGA (land grid array) sockets, and has acquired a high-frequency test and burn-in socket line, furthering growth in the test socket market.ARIES SUCCESS RESULTS FROM MASTERING SEVERAL MANUFACTURING PROCESSES…
- Custom High-Frequency (RF) Socket Design (-1dB Bandwidth at >60GHz)
- Patented Limited-Depth Pin Assembly (Correct-A-Chip Adaptors)
- Surface-mounting of Electronic Components onto adaptors
- Molding Engineered Plastics with Extremely Tight Tolerances (for devices on <0.2mm pitch)
- Bending Pins (Vertisocket™Line) LED/LCD applications
- Installation of Pins into Plastic
- Crimping Connectors on Flat Cable
- Flat Cable Wire Stripping and Separation
