Please be reminded that delivery will be around 24 weeks or more on some of our backordered products subjected to factory confirmation.
Email us at aspeed-order@aspeedelectronics.com for more info.

28-3571-16

28-3571-16

$39.860 USD

CONN IC DIP SOCKET ZIF 28POS TIN

Available on Backorder: Manufacturer lead time 10-12 weeks

Price Breakdown

Quantity Price
1 - 99 $39.860 USD
100 - 499 $33.880 USD
500 - 999 $29.900 USD
1,000 - 2,499 $27.900 USD
2,500+ $25.910 USD

For More than 5000 pcs, You can contact us and request for price
SKU: 28-3571-16 Categories: , , ,

Description

GENERAL SPECIFICATIONS

  • STANDARD SOCKET BODY: (for -10, -10TL, -11, -16 sockets) black UL 94V-0 glass-filled
    Polyphenylene Sulfide (PPS)
  • HIGH-TEMPERATURE SOCKET BODY: (for -18 socket) natural color Polyetheretherketone
    (PEEK)
  • HANDLE: Stainless Steel
  • HANDLE KNOB: Brass 360, 1/2-hard (no knob on loop handle)
  • CONTACT MATERIAL: (for -10, -10TL, -11) BeCu 172 per QQ-C-553; (for -16)
    Spinodal; (for -18) BeNi 360, 1/2-hard
  • BeCu CONTACT PLATING: 50µ [1.27µ] min. Ni under plate per QQ-N-290,
    over plated with either: -10 200µ [5.08µ] min. matte Sn per ASTM
    B545-97; or -10TL 200µ [5.08µ] min. 90/10 Sn/Pb per MIL-T-10727-11
    10µ [0.25µ] min. Au per MIL-G-45204
  • SPINODAL CONTACT PLATING: (for -16) 50µ [1.27µ] min. NiB
  • HIGH-TEMPERATURE BeNi CONTACT PLATING: (for -18) 50µ [1.27µ]
    NiB
  • CONTACT CURRENT RATING: 1 amp
  • INSULATION RESISTANCE: 1000 MΩ min.
  • DIELECTRIC WITHSTANDING VOLTAGE: 1000 VAC
  • LIFE CYCLE: 25,000 to 50,000 cycles
  • OPERATING TEMPERATURE: min. -85°F [-65°C]; max. 221°F [105°C]
    for Sn plating, 302°F [150°C] for Au plating, 392°F [200°C] for
    NiB plating, 482°F [250°C] for high-temperature socket
  • RETENTION FORCE (closed): 55 grams/pin based on a 0.020 [0.51] dia. test
    lead
  • ACCEPTS LEADS: 0.015-0.035 [0.38-0.89] wide, 0.110-0.280 [2.79-7.11] long

FEATURES

  • Universal ZIF DIP Test Socket accepts devices on 0.300 to 0.600 [7.62 to 15.24] centers
  • All pin count sockets go into PCB with either 0.300 or 0.600 [7.62 to 15.24]
    centers
  • Swing quick-release handle down to open contacts and insert device. Release
    and handle automatically returns as contacts close onto device leads
  • Socket handle can be mounted on either the right or left side
  • Sockets can be soldered into PCBs or plugged into any socket

Download: Datasheet

Additional information

Country Of Origin

US

Brand

Aries Electronics

Corporate History

Aries Electronics, incorporated in 1972, began when the late William “Bill” Sinclair purchased the back panel line from Thomas & Betts Corporation. The line included IC sockets, headers, and printed circuit cards. Under Bill’s vision, Aries expanded the line to encompass a wide variety of packaging products, including sockets, headers and covers, programmable devices and a variety of jumper and cable assemblies. Aries has become established in the industry as a major source for unique connector products that solve a wide variety of packaging problems. Aries is the recognized industry leader in ZIF (Zero-Insertion-Force) Test Sockets for DIP, PGA, PLCC, and SOIC devices, and continues to be a leading source for a wide variety of specialty electronic connectors. In recent years, the company has made major inroads in the market for high-temperature sockets and flexible cable products. The addition of the Correct-A-Chip® product line established the company as a major source for “intelligent connectors” (incorporating other components, both passive and active), adapters (connectors that allow the use of one termination style on a board designed for a different termination style). Most recently, the company has developed and patented several concepts for BGA (ball grid array) and LGA (land grid array) sockets, and has acquired a high-frequency test and burn-in socket line, furthering growth in the test socket market.

ARIES SUCCESS RESULTS FROM MASTERING SEVERAL MANUFACTURING PROCESSES…

  • Custom High-Frequency (RF) Socket Design (-1dB Bandwidth at >60GHz)
  • Patented Limited-Depth Pin Assembly (Correct-A-Chip Adaptors)
  • Surface-mounting of Electronic Components onto adaptors
  • Molding Engineered Plastics with Extremely Tight Tolerances (for devices on <0.2mm pitch)
  • Bending Pins (Vertisocket™Line) LED/LCD applications
  • Installation of Pins into Plastic
  • Crimping Connectors on Flat Cable
  • Flat Cable Wire Stripping and Separation
Our corporate objective of continued growth within the electronic packaging area, further establishes our position as a major international connector manufacturer. Our target growth markets are additional ZIF Test Socket applications and further expansion of our Correct-A-Chip® capabilities, with particular emphasis in the area of pick-and-place. Our marketing has been through manufacturers’ representatives and distributors throughout the United States and Canada; through European distributors reporting to our sales office in Holland, and through our authorized agents in the rest of the world. [ninja_form id=4]

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