48-6552-18
$126.480 USD
CONN IC DIP SOCKET ZIF 48POS
Available on Backorder: Manufacturer lead time 10-12 weeks
Description
GENERAL SPECIFICATIONS
- SOCKET BODY: natural UL 94V-0 glass-filled Polyetheretherketone (PEEK)
- HANDLE: Stainless Steel
- CONTACTS: BeNi 360, 1/2-hard
- CONTACT PLATING: 50μ [1.27μ] min. NiB : for 300°C [572°F] 100µ inches [2.54µm] min. Au, MIL-G-45204, Type 1 (no hardeners or additives) over 100µ inches [2.54µm] min. low-stress Ni
- CONTACT CURRENT RATING: 1 amp
- OPERATING TEMPERATURE: Operating Temperatures: -85°F to 482°F [-65°C to 250°C] NiB version
-85°F to 572°F [-65°C to 300°C] heavy Au version - RETENTION FORCE (closed): 55 grams/pin based on a 0.020 [0.51] dia. test
lead - INSULATION RESISTANCE: 1000 MΩ min.
- DIELECTRIC WITHSTANDING VOLTAGE: 1000 VAC
- LIFE CYCLE: 25,000 to 50,000 cycles
- ACCEPTS LEADS: 0.015-0.045 [0.38-1.14] wide, 0.110-0.280 [2.79-7.11] long
FEATURES
- SOCKET BODY: natural UL 94V-0 glass-filled Polyetheretherketone (PEEK)
- HANDLE: Stainless Steel
- CONTACTS: BeNi 360, 1/2-hard
- CONTACT PLATING: 50μ [1.27μ] min. NiB : for 300°C [572°F] 100µ inches [2.54µm] min. Au, MIL-G-45204, Type 1 (no hardeners or additives) over 100µ inches [2.54µm] min. low-stress Ni
- CONTACT CURRENT RATING: 1 amp
- OPERATING TEMPERATURE: Operating Temperatures: -85°F to 482°F [-65°C to 250°C] NiB version
-85°F to 572°F [-65°C to 300°C] heavy Au version - RETENTION FORCE (closed): 55 grams/pin based on a 0.020 [0.51] dia. test
lead - INSULATION RESISTANCE: 1000 MΩ min.
- DIELECTRIC WITHSTANDING VOLTAGE: 1000 VAC
- LIFE CYCLE: 25,000 to 50,000 cycles
- ACCEPTS LEADS: 0.015-0.045 [0.38-1.14] wide, 0.110-0.280 [2.79-7.11] long
Download: Datasheet
Additional information
Country Of Origin | US |
---|
Brand
Aries Electronics
Corporate History
Aries Electronics, incorporated in 1972, began when the late William “Bill” Sinclair purchased the back panel line from Thomas & Betts Corporation. The line included IC sockets, headers, and printed circuit cards. Under Bill’s vision, Aries expanded the line to encompass a wide variety of packaging products, including sockets, headers and covers, programmable devices and a variety of jumper and cable assemblies. Aries has become established in the industry as a major source for unique connector products that solve a wide variety of packaging problems. Aries is the recognized industry leader in ZIF (Zero-Insertion-Force) Test Sockets for DIP, PGA, PLCC, and SOIC devices, and continues to be a leading source for a wide variety of specialty electronic connectors. In recent years, the company has made major inroads in the market for high-temperature sockets and flexible cable products. The addition of the Correct-A-Chip® product line established the company as a major source for “intelligent connectors” (incorporating other components, both passive and active), adapters (connectors that allow the use of one termination style on a board designed for a different termination style). Most recently, the company has developed and patented several concepts for BGA (ball grid array) and LGA (land grid array) sockets, and has acquired a high-frequency test and burn-in socket line, furthering growth in the test socket market.ARIES SUCCESS RESULTS FROM MASTERING SEVERAL MANUFACTURING PROCESSES…
- Custom High-Frequency (RF) Socket Design (-1dB Bandwidth at >60GHz)
- Patented Limited-Depth Pin Assembly (Correct-A-Chip Adaptors)
- Surface-mounting of Electronic Components onto adaptors
- Molding Engineered Plastics with Extremely Tight Tolerances (for devices on <0.2mm pitch)
- Bending Pins (Vertisocket™Line) LED/LCD applications
- Installation of Pins into Plastic
- Crimping Connectors on Flat Cable
- Flat Cable Wire Stripping and Separation
