Please be reminded that delivery will be around 24 weeks or more on some of our backordered products subjected to factory confirmation.
Email us at aspeed-order@aspeedelectronics.com for more info.

SP200

$2.390 USD

PLUG SHORTING INSULATED BLACK

Available on Backorder: Manufacturer lead time 10-12 weeks

Price Breakdown

Quantity Price
1 - 99 $2.390 USD
100 - 499 $2.030 USD
500 - 999 $1.790 USD
1,000 - 2,499 $1.660 USD
2,500+ $1.550 USD

For More than 5000 pcs, You can contact us and request for price
SKU: SP200 Category:

Description

GENERAL SPECIFICATIONS

SHORTING JACK (SJ200) SPECIFICATIONS

  • BODY MATERIAL: Black UL 94V-0 Glass-filled 4/6 Nylon
  • PIN BODY: Brass 360 1/2-hard per UNS C36000 ASTM-B16-00
  • PIN BODY PLATING: 200μ [5.08μm] min. Sn per ASTM B545 Type 1 over 100μ [2.54μm] min. Ni per SAE-AMS-QQ-N-290 -OR- 200μ [5.08μm] min. 93/7 Sn/Pb per ASTM B545 over 100μ [2.54μm] min. Ni per SAE-AMS-QQ-N-290
  • 4-FINGER COLLET CONTACT: Be-Cu per UNS C17200 ASTM-B194-01
  • CONTACT PLATING: 30μ [0.76μm] min. Au per MIL-G-45204 over 50μ [1.27μm] min. Ni per SAE-AMS-QQ-N-290
  • CONTACT CURRENT RATING: 8 amps
  • OPERATING TEMPERATURE: -67°F to 221°F [-55° to 105°C]
  • INSERTION FORCE: 240 grams/pin
  • WITHDRAWAL FORCE: 130 grams/pin
  • NORMAL FORCE: 210 grams/pin, based on a 0.040 [1.02] dia. test lead
  • ACCEPTS LEADS: 0.032-0.047 [0.81-1.19] in dia., 0.130-0.180 [3.30- 4.56] long

SHORTING PLUG (SP200) SPECIFICATIONS

    • BODY MATERIAL: Black UL 94V-0 Glass-filled 4/6 Nylon
    • PIN: Brass 260 1/4- or 1/2-hard
    • PIN PLATING: 10μ [0.25μm] Au per MIL-G-45204 over 50μ [1.27μm] Ni per SAE-AMS-QQ-N-290
    • CONTACT CURRENT RATING: 5 amps
    • OPERATING TEMPERATURE: -67°F to 221°F [-55° to 105°C]

FEATURES

  • These Shorting Plugs and Jacks are used in conjunction with Aries DIP Strips, available separately, for your programming needs. Consult Data Sheet 16007 and Data Sheet 16008 for details
  • Convenient handle for insertion and withdrawal

Download: Datasheet

Additional information

Country Of Origin

US

Brand

Aries Electronics

Corporate History

Aries Electronics, incorporated in 1972, began when the late William “Bill” Sinclair purchased the back panel line from Thomas & Betts Corporation. The line included IC sockets, headers, and printed circuit cards. Under Bill’s vision, Aries expanded the line to encompass a wide variety of packaging products, including sockets, headers and covers, programmable devices and a variety of jumper and cable assemblies. Aries has become established in the industry as a major source for unique connector products that solve a wide variety of packaging problems. Aries is the recognized industry leader in ZIF (Zero-Insertion-Force) Test Sockets for DIP, PGA, PLCC, and SOIC devices, and continues to be a leading source for a wide variety of specialty electronic connectors. In recent years, the company has made major inroads in the market for high-temperature sockets and flexible cable products. The addition of the Correct-A-Chip® product line established the company as a major source for “intelligent connectors” (incorporating other components, both passive and active), adapters (connectors that allow the use of one termination style on a board designed for a different termination style). Most recently, the company has developed and patented several concepts for BGA (ball grid array) and LGA (land grid array) sockets, and has acquired a high-frequency test and burn-in socket line, furthering growth in the test socket market.

ARIES SUCCESS RESULTS FROM MASTERING SEVERAL MANUFACTURING PROCESSES…

  • Custom High-Frequency (RF) Socket Design (-1dB Bandwidth at >60GHz)
  • Patented Limited-Depth Pin Assembly (Correct-A-Chip Adaptors)
  • Surface-mounting of Electronic Components onto adaptors
  • Molding Engineered Plastics with Extremely Tight Tolerances (for devices on <0.2mm pitch)
  • Bending Pins (Vertisocket™Line) LED/LCD applications
  • Installation of Pins into Plastic
  • Crimping Connectors on Flat Cable
  • Flat Cable Wire Stripping and Separation
Our corporate objective of continued growth within the electronic packaging area, further establishes our position as a major international connector manufacturer. Our target growth markets are additional ZIF Test Socket applications and further expansion of our Correct-A-Chip® capabilities, with particular emphasis in the area of pick-and-place. Our marketing has been through manufacturers’ representatives and distributors throughout the United States and Canada; through European distributors reporting to our sales office in Holland, and through our authorized agents in the rest of the world. [ninja_form id=4]